Novellus & IBM Form Cu TSV Joint Dev Program

This press release from Novellus flashed across my screen today.  Apparently they have set up a joint effort with IBM to commercialize a Cu TSV process using:

IBM Chilling Chip Stacks with Fluid in Microchannels

EETimes has a very interesting story about work at IBM, along with École Polytechnique Fédérale de Lausanne (EPFL) and the Swiss Federal Institute of Technology Zurich (ETH).  They're using fluids (including, perhaps, water) passing through 50 µm diameter microchannels to cool stacked die.