Showing posts with label FPGA. Show all posts
Showing posts with label FPGA. Show all posts
2010/07/28
Farewell Tier Logic - We hardly knew you
I'm quite disheartened by the report that Tier Logic has gone the way of so many other promising FPGA startups.
2010/03/11
Tier Logic Uncloaks – It’s a 3D FPGA Company!
Just as I was getting ready to head over to the IEEE CPMT-SCV 3D IC Integration meeting last night, this fascinating story popped up. Tier Logic, a Santa Clara 3D FPGA venture has finally dropped their cloak of invisibility to reveal another 3D FPGA company.
2010/02/02
NuPGA Leverages 3D Stacks to Revolutionize Programmable Logic
EETimes had a great article covering the exciting developments at NuPGA (Their site is currently "Under Construction" — Hopefully more will come, soon).
Labels:
3D devices,
3D interconnect,
FPGA,
stacked die,
thru-silicon-vias,
TSV
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