Showing posts with label Philip Garrou. Show all posts
Showing posts with label Philip Garrou. Show all posts
2010/03/22
IMAPS Conference - Great Stuff!
The International Microelectronics and Packaging Society (IMAPS) recently wrapped up their 6th International Conference and Exhibition on Device Packaging. For those of us that couldn't swing a week in Scottsdale, we can thank Dr. Phil Garrou, the event's General Chair, and well known 3D technology expert, for posting a great synopsis. Some of the key points include:
Labels:
3D devices,
3D integration,
3D interconnect,
EDA,
Philip Garrou
2010/03/05
Dr. Garrou on SEMI's Industry Strategy Symposium 2010
One of the benefits of following sources like Perspectives From the Leading Edge is that I get a peek into events that wouldn't allow a simple engineer like me through the venue doors.
Labels:
3D integration,
4DChips,
Philip Garrou,
scaling,
stacked die
2010/02/26
Great Blog: Perspectives From the Leading Edge
I recently came across another great blog, "Perspectives From the Leading Edge," that focuses on vertical integration technology.
Labels:
3D devices,
3D integration,
3D interconnect,
Philip Garrou
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