And another technology, 3-D devices based on thru-silicon vias (TSVs), is still in the embryonic stages and "overhyped," said Trevor Yancey, an analyst with IC Insights. There is a lot of hype about TSVs for 3-D devices, but there are still issues about the substrates, testing and costs, he said.
Some think TSVs will take longer to ramp for mainstream applications. In other words, three enablers that can help pave the way for Moore's Law--450-mm, EUV and TSVs--are still more talk than reality.
While I'd certainly agree that we're in the early stages, we're seeing significant technological advances (including our own) that will accelerate progress. Further, the pressures on system designers to meet functionality requirements within cost, space and power constraints will force more rapid adoption of technology like TSV based vertical integration. Or, perhaps, we're just guilty of contributing to the "overhyped" discussion, but I don't think so…
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