Another One Bites the Dust: National Semi

According to a story in the Wall Street Journal, TI plans to acquire National Semiconductor for US$6.5B

EETimes: Momentum builds for 3-D chips

The wise folks over at EETimes have a nice piece identifying the "rise" (get it?) of die stacking.

Wow, Tabula Scores Some Serious $$

Congratulations to the folks at Tabula on raising US$108M in their Series D round.  It looks like they'll have an opportunity to take a run at grabbing the brass ring.

Is it Packaging, or is it Fab?

There's an interesting story up on EDN, titled "Wafer-level packaging pushes past new mobile demands."  The gist of the discussion seems to be exploring where packaging ends and 3-D IC fabrication begins.

Farewell Tier Logic - We hardly knew you

I'm quite disheartened by the report that Tier Logic has gone the way of so many other promising FPGA startups.

TSMC Vaporware: 3-D "Ecosystem"

EETimes reports that TSMC is:

"… putting the pieces in place to enable 3-D designs based on silicon interposers and through silicon vias (TSVs)."

Elpida Prepping for 3-D Commercialization

Semiconductor International has a very informative story regarding 3-D directions at Elpida Memory, Inc.