Showing posts with label EDA. Show all posts
Showing posts with label EDA. Show all posts
2010/03/22
IMAPS Conference - Great Stuff!
The International Microelectronics and Packaging Society (IMAPS) recently wrapped up their 6th International Conference and Exhibition on Device Packaging. For those of us that couldn't swing a week in Scottsdale, we can thank Dr. Phil Garrou, the event's General Chair, and well known 3D technology expert, for posting a great synopsis. Some of the key points include:
Labels:
3D devices,
3D integration,
3D interconnect,
EDA,
Philip Garrou
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