Showing posts with label Novellus. Show all posts
Showing posts with label Novellus. Show all posts
2010/03/17
Novellus & IBM Form Cu TSV Joint Dev Program
This press release from Novellus flashed across my screen today. Apparently they have set up a joint effort with IBM to commercialize a Cu TSV process using:
Labels:
3D devices,
3D interconnect,
Cu,
IBM,
Novellus,
Tezzaron,
thru-silicon-vias,
TSV
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