Elpida Prepping for 3-D Commercialization

Semiconductor International has a very informative story regarding 3-D directions at Elpida Memory, Inc.

IEEE CPMT-SCV Meeting Report - 3D IC Integration: The Next Generation of Electronics (Updated)

The IEEE Components, Packaging and Manufacturing Technology Society, Santa Clara Valley Chapter put together a great program last night:  "3D IC Integration: The Next Generation of Electronics."  The speaker, Dr. W. R. Bottoms, did a wonderful job of illuminating the current state of the industry.  He clearly shares the excitement that we've been blogging about.  I even managed to pick up some interesting tidbits by paying attention to the conversations at the meeting.