Applied Materials Announces New Equipment for 3-D

Applied Materials recently put out a press release to announce some very interesting new equipment for 3-D fabrication.  The Applied Producer® InVia™ dielectric deposition system uses CVD to deposit the oxide liner for TSVs.  The company claims that their new equipment:

"… has much higher throughput than batch furnaces, with the capability to process up to eight times more wafers per hour at less than half the cost, especially when depositing very thick liners for high performance applications.  Competing PECVD systems are unable to deposit oxide films evenly in deep, narrow vias, making this approach unsuitable for HAR (High Aspect Ratio) applications."

EETimes has a more comprehensive story on the new gear.

This is one more bit of evidence that 3-D is moving out of the lab, and into the mainstream of commercial semiconductor products.

---