I came across this excellent slide deck titled Through Silicon Vias (TSV): Design and Reliability (PDF) from our friends at ALLVIA, the TSV foundry specialists.
It appears that the material was presented at an IEEE Components, Packaging and Manufacturing Technology Society, Santa Clara Valley Chapter event in May of 2009, so it may not reflect their current bleeding edge. However, I think that the material gives an excellent overview of TSV technology as well as a good introduction to the company. You should check this slide deck out. The pictures alone more than justify a look!
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