2010/02/12

Exciting 3D IC Integration Event Coming Up!

The IEEE Components, Packaging and Manufacturing Technology Society, Santa Clara Valley Chapter is putting together what promises to be an extremely interesting program titled, "3D IC Integration: The Next Generation of Electronics."  The fun will commence at 6:00 PM on Wednesday, March 10, 2010, in Santa Clara.

Dr. W. R. Bottoms, Chairman, Third Millennium Test Solutions, is the presenter.  The overview for the talk is very much in line with the issues that we're addressing at 4D Chips, so I'm really looking forward to it:

The semiconductor industry has followed a path defined by Moore's Law for 40 years.  This has resulted in unprecedented progress but we are clearly nearing the end of Moore's Law scaling.  The concept of equivalent scaling and other changes to maintain that rate of progress have been defined as "More than Moore".  The most important of these is 3D integration.  Although there has been significant progress in development of 3D technologies it has not yet reached the high volume production mainstream.  Recent progress such as the advent of 3D standards will result in the emergence of high volume 3D IC production in 2010.  The major driving issues and challenges associated with 3D IC production and the outlook for future 3D integration will be discussed.

I'll be at both the dinner and the presentation.  I'm looking forward meeting up with anyone else who plans to attend.  Please come over to say, "Hi," and let me know what you think of this blog.  I'll see you on the 10th!


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